Industry-Aligned Advanced Certification

Advanced Certification in IC Packaging & Manufacturing

Gain industry-ready skills in semiconductor packaging, OSAT workflows, and advanced chip manufacturing with IIT expertise

9 Months | Online + IIT Roorkee Immersion

Start your semiconductor career journey today.

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WHO SHOULD APPLY

Who Can Join This
Advanced Certification in IC Packaging & Manufacturing?

Final year ECE / EEE / CSE students

Electronics & semiconductor graduates

Working professionals in VLSI domain

Engineers shifting to semiconductor industry

Candidates targeting OSAT roles

PROGRAM DETAILS

Program Highlights

Learn directly from IIT faculty and industry experts

2-day campus immersion experience at IIT Roorkee

Industry masterclasses by practicing packaging engineers

Peer networking with India’s semiconductor talent community

Industry-aligned capstone project with real use cases

Placement assistance and career guidance support

Flexible online delivery for working professionals and graduates

PROGRAM CURRICULUM

Advanced Certification in IC Packaging & Manufacturing Curriculum

MODULE_01

Basic Electronics

Introduction To Electronics
Semiconductor Devices
Electronic Devices

MODULE_02

Fundamentals Of Analog Circuit Design

Introduction To Analog Circuits
Circuit Analysis
Feedback In Analog Circuits
Frequency Response of Analog Circuits
Filters and Signal Processing Circuits
Power Supply Network Design

MODULE_03

Digital Electronics

Introduction to Digital Electronics
Logic Circuits and FSM Concepts
Digital Circuit Design Methodologies

MODULE_04

VLSI Fabrication and Technology

Introduction to VLSI Fabrication
VLSI Fabrications steps
CMOS Process Flow
Advanced Process Technologies
Emerging Trends in VLSI Fabrication

MODULE_05

Basics of EM & Thermal Analysis

Fundamentals of Electromagnetics
Signal Integrity
Power Integrity
EM Modelling and Simulation
EMI Mitigation Techniques
Mechanical Design
Thermal Design
Reliability

MODULE_06

IC Packaging Basics and Designing Flipchip Package

IC Packaging Introduction
IC Packaging Planning Prototyping/ Codesign
IC Packaging FlipChip Layout Design
IC Packaging WireBond Layout Design
Analysis of IC Packages

MODULE_07

IC Packaging Manufacturing

Semiconductor Manufacturing Flow
Wafer Dicing & Die Preparation
Die Attach & Interconnect Technologies
Substrate Manufacturing
Encapsulation & Molding
Thermal Management
Reliability & Qualification
Testing & Yield Engineering
Advanced Packaging Manufacturing

MODULE_08

Project Work

End-to-end IC Package Design Project
Industry-Aligned Problem Statement

Career Transition

What You Will Gain

Career Upgrade

Semiconductor industry readiness

Strong IC packaging fundamentals

Hands-on project experience

IIT certification advantage

OSAT workflow understanding

Career-focused skill development

TARGET_ROLES

Career Opportunities

Packaging Design Engineer

Semiconductor Process Engineer

OSAT Engineer

Reliability Engineer

Test & Validation Engineer

Manufacturing Engineer

250+ Global Hiring
Partners

ASIC_FLOW_MOD_01

Start Your Semiconductor Journey

Take the Next Step in Your Semiconductor Career

Build your career in India’s growing semiconductor industry with IIT-backed certification.

Designed with IIT ecosystem expertise and industry alignment, this program offers practical semiconductor training focused on IC packaging, manufacturing, and advanced chip technologies.

Advanced Certification in IC Packaging & Manufacturing

Start your semiconductor career journey today.